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PACK EXPO International 2026 Student Programs: Competitions, Robotics and Career Connections

PACK EXPO International 2026 will put students on the show floor, not on the sidelines. From Oct. 18 to 21 at McCormick Place in Chicago, the next generation of packaging and processing professionals will build machines, demonstrate robots, race between exhibitor booths and meet potential employers, with six high school teams competing for up to $20,000 in the PACK Challenge.

The programs are organized by PMMI, the Association for Packaging and Processing Technologies, and bring students face-to-face with the technologies, companies and professionals shaping the industry. The announcement was issued on Oct. 8, 2026, from Herndon, Virginia.

Student programs at PACK EXPO International 2026

Through hands-on competitions, demonstrations, tours, career development and networking, students can experience the industry in action while building connections for their own futures. Four programs anchor the offer.

PACK Challenge: a machine-building showdown

Six high school teams earned their spot in the qualifiers with inventive designs and now compete in tasks such as Factory Acceptance Test, sales and marketing, and operator training. Teams may win up to $20,000. The finalists are:

  • Alexandria Area High School
  • Legacy Christian Academy and Becker High School Coalition
  • Rich Township High School
  • Sartell High School
  • South Shore Technical High School
  • Waterford Union High School

Future Innovators Robotics Showcase

Sponsored by Schneider Electric, this showcase lets visitors see high school robotics teams demonstrate their design, engineering and troubleshooting skills live. Participating teams:

  • Armada Robotics (FRC 2508)
  • Charger Robotics (FRC 5348)
  • First Starforce (FRC 11173)
  • Gear Wizards (FTC 16917)
  • Golden Ratio Robotics (FTC 12882)
  • Monty Pythons (FRC 2151)
  • Random Engineers (FTC 23802)
  • Sartell Robotics (FRC 6045)
  • Sensory Overload (FTC 25956)
  • That ONE Team – Our Next Engineers (FRC 4967)

Students PACK the EXPO

Students from local Chicago-area schools will take to the show floor to experience the event through a virtual scavenger hunt, student tours and a lunch-and-learn session.

Amazing Packaging Race

Sponsored by SICK, Inc., this fun and educational event sends teams from colleges and universities across North America racing around the show floor to complete a series of tasks at participating exhibitor booths. The exhibitors taking part are:

  • All-Fill Inc.
  • B&R Industrial Automation
  • Beckhoff Automation
  • BW Packaging
  • Carleton Helical Technologies
  • CMCO Conveyance Solutions
  • Cold Pressure Council (CPC)
  • Delta Modtech
  • Duravant
  • Econocorp Inc
  • Fallas Automation Inc.
  • FOX IV Technologies, Inc.
  • Fresh-Lock By Presto Products
  • HARPAK-ULMA Packaging, LLC
  • HEISLER Industries, Inc.
  • Hoosier Feeder
  • Institute of Packaging Professionals, IoPP
  • LinMot USA
  • Morrison Container Handling Solutions
  • OMAC
  • PAC Machinery
  • Pacteon Group
  • Pepperl+Fuchs
  • Rinco Ultrasonics USA, Inc.
  • Shurtape Technologies
  • SICK
  • Siemens Digital Industries
  • Starview Packaging Machinery
  • Triangle Package Machinery Company

Workforce Development Pavilion

The Workforce Development Pavilion is the resource hub for strengthening the existing workforce and nurturing the future one. Attendees can explore PMMI U’s offerings, including sought-after training workshops. Colleges and universities showcase their mechatronics, packaging and processing programs, and companies can engage with students interested in careers in the industry. Participating schools:

  • Brigham Young University – Idaho
  • Cal Poly Packaging
  • Clemson University Packaging Science
  • Fresno State University
  • Hennepin Tech College
  • Illinois Tech – Food Science and Nutrition Department
  • Indiana State University
  • Michigan State University School of Packaging
  • North Carolina State University
  • Northwood Technical College
  • Purdue University Northwest
  • Rochester Institute of Technology
  • Rutgers Packaging Engineering Program
  • San Jose State University
  • Toronto Metropolitan University
  • Tuskegee University
  • University of Florida
  • University of Wisconsin – Stout
  • Virginia Tech

Networking opportunities for students

  • Student Tours: PMMI staff will conduct tours of the show floor on Sunday and Monday at 3:30 p.m. Tours start at the PMMI U and PMMI Foundation Booth.
  • Student Lounge: open for students to meet with HR professionals to discuss career opportunities, receive resume-writing tips and attend interview workshops. Interview workshops run on Monday, Tuesday and Wednesday at 1:00 p.m., and on Tuesday and Wednesday at 10:00 a.m.
  • Packaging & Processing Women’s Leadership Network (PPWLN) Breakfast: students attending the show are invited to the breakfast on Tuesday, Oct. 20.
  • Tour with the PPWLN Executive Council: after the breakfast, members of the Executive Council will lead a guided tour for the students.

More details on student opportunities are available on the official student opportunities page of PACK EXPO International.

Why PMMI is investing in the next generation

“PACK EXPO International is a place where students can connect with future employers and glimpse the real-world machinery, challenges, and solutions they may encounter in a career. By bringing these opportunities to students, we are investing in the future of our industries and preparing a skilled next-generation workforce.”

— Kate Torrence, director, workforce development, PMMI

The same theme runs through other PACK EXPO International 2026 coverage on Envapack, such as the show’s overall program and PMMI’s study on sustainable packaging materials.

PACK EXPO International 2026 at a glance

As the largest packaging and processing industry event in North America, PACK EXPO International is set to feature over 2,700 exhibitors across 1.3 million net square feet, with 48,000 attendees from more than 40 vertical markets. It takes place Oct. 18–21 at McCormick Place, Chicago. Registration is available at packexpointernational.com. Another example of what exhibitors are bringing: Hastamat and LoeschPack’s German engineering for PACK EXPO Chicago.

Frequently Asked Questions

When and where is PACK EXPO International 2026?

It takes place Oct. 18–21, 2026, at McCormick Place in Chicago.

What can students do at PACK EXPO International 2026?

They can watch or take part in the PACK Challenge, the Future Innovators Robotics Showcase, Students PACK the EXPO and the Amazing Packaging Race, visit the Workforce Development Pavilion, join student tours and use the Student Lounge to meet HR professionals.

How much can teams win in the PACK Challenge?

Teams may win up to $20,000. Six high school teams compete in tasks such as Factory Acceptance Test, sales and marketing, and operator training.

Can students meet potential employers at the show?

Yes. The Student Lounge lets students meet HR professionals, get resume-writing tips and attend interview workshops, and companies can engage with interested students at the Workforce Development Pavilion.

How big is PACK EXPO International 2026?

The show is set to feature over 2,700 exhibitors across 1.3 million net square feet and 48,000 attendees from more than 40 vertical markets.

About PMMI

PMMI, the Association for Packaging and Processing Technologies, represents more than 1,100 manufacturers and suppliers of equipment, components and materials, as well as providers of related equipment and services to the packaging and processing industry. It connects consumer goods companies with manufacturing solutions through the PACK EXPO portfolio of trade shows (PACK EXPO International, PACK EXPO Las Vegas, PACK EXPO East, PACK EXPO Southeast, EXPO PACK México and EXPO PACK Guadalajara) and PMMI Media Group. More at pmmi.org and packexpo.com.

Source: PMMI press release, Oct. 8, 2026.

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