When PACK EXPO International returns to Chicago this October, it will bring together the latest technologies, industry expertise and networking opportunities that are shaping the future of packaging and processing.
The event, which will take place from October 18 to 21 at McCormick Place, expects to attract 48,000 packaging and processing professionals, representing more than 40 vertical markets. At a time when the industry continues to face labor shortages, sustainability requirements, digital transformation and supply-chain pressures, the show gives attendees the opportunity to explore solutions firsthand through live demonstrations, education programs and direct access to suppliers.
Technology and Innovation Take Center Stage
Automation, artificial intelligence (AI), robotics and sustainability remain among the most influential trends affecting manufacturers today. At PACK EXPO International, attendees will be able to evaluate emerging technologies designed to improve efficiency, reduce downtime, enhance product quality and support sustainability goals.
Smart packaging solutions, connected manufacturing systems, predictive maintenance technologies and advanced robotics will be present throughout the exhibit floor, allowing visitors to compare solutions side by side and identify technologies that can be implemented in their own operations.
More Than 150 Education Sessions
Education remains a cornerstone of the PACK EXPO experience, with more than 150 free sessions scheduled across multiple stages throughout the event.
The «Innovation Stages» will feature supplier-led presentations focused on topics such as automation, artificial intelligence, robotics, Extended Producer Responsibility (EPR), sustainable design and Sunrise 2027 initiatives.
For food and beverage manufacturers, the «Food & Beverage Processing Innovation Stage» will explore advances in food safety, processing technologies, sustainability, AI applications, ultra-high-temperature processing and high-pressure processing.
«Sustainability Central», presented by Packaging World and sponsored by EFP, LLC., will offer expert-led discussions on value-chain optimization, circularity, sustainable packaging solutions, e-commerce, the evolution of packaging legislation and the increasingly important role of AI in sustainability efforts.
Meanwhile, the «Industry Speaks » stage will bring together leaders from organizations such as Amazon, Conagra, the Flexible Packaging Association, the Consumer Brands Association, MHI and AMERIPEN to discuss the current industry landscape and its future direction. Topics will include artificial intelligence, sustainability, Extended Producer Responsibility (EPR) and the evolution of policy.
Attendees interested in reusable packaging systems will also be able to visit the «Reusable Packaging Learning Center», sponsored by the Reusable Packaging Association, which will focus on strategies to improve material-handling performance, reduce costs and minimize environmental impact.
Networking Opportunities Across the Industry
Beyond the exhibits and educational programming, PACK EXPO International will feature a wide range of networking events.
Among the most notable events is «A Night Out with PACK gives BACK™», scheduled for Monday evening at the House of Blues in Chicago. The event combines industry networking with a live performance by Third Eye Blind, while raising funds for the PMMI Foundation.
The breakfast of the Packaging & Processing Women’s Leadership Network (PPWLN) will feature Col. Nicole Malachowski, U.S. Air Force (Ret.), the first woman Thunderbirds pilot, as its keynote speaker. Her presentation will focus on leadership and professional growth within industries traditionally dominated by men.
Young professionals will have the opportunity to network during the «Young Professionals Networking Reception», while «Industry Meets at PACK EXPO» will host association meetings throughout the week for packaging and processing professionals.
Other networking opportunities include the Confectionery Industry Reception, hosted by the National Confectioners Association, which will bring together manufacturers and suppliers in the sector for informal conversations and relationship building.
New Programs for Emerging Leaders and SMBs
Several new initiatives are expected to generate significant buzz at this year’s edition.
The first edition of the CPG NexGen Awards will recognize young professionals who are driving innovation and leadership in the packaging and processing sectors. Honorees will receive industry-wide recognition, plus a VIP experience at PACK EXPO International.
Small and mid-sized manufacturers will benefit from the new SMB FastTrack program, which offers targeted educational resources focused on artificial intelligence, workforce development, food safety and digital manufacturing. Participating exhibitors will be identified as «SMB friendly», helping attendees quickly locate relevant solutions.
The PACK EXPO Discovery Tours will also offer expert-guided experiences designed to help attendees navigate the show floor efficiently and identify the technologies most relevant to their operations.
Addressing Industry Challenges
As manufacturers face increasing pressure to improve productivity, address labor shortages, comply with changing regulations and meet sustainability goals, PACK EXPO International serves as a centralized resource for practical solutions.
Through live equipment demonstrations, education sessions and direct interaction with technology suppliers, attendees can gain practical insights into automation, robotics, smart manufacturing, sustainable packaging, food safety and digital transformation.
For companies looking to stay competitive in a rapidly evolving market, PACK EXPO International continues to offer one of the industry’s most complete opportunities to learn, network and discover upcoming trends.
Visit packexpointernational.com today for more information. Priority registration costs $30 through September 25, 2026; after that, the price will increase to $130.
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