From Dusseldorf Interpack 17: Industry 4.0 – From Vision to Reality

The digital transformation towards networked production environments in terms of Industry 4.0 (I4.0) and/or the Internet of Things (IoT) is gaining momentum. Numerous applications from the areas of product and process monitoring, labelling technology, packaging, logistics as well as maintenance and repair show already today the optimisation potential that this transformation to the Internet of …

Beauty out of the tube, glass and jar

“Beauty is everywhere a very welcome guest,” wrote Johann Wolfgang von Goethe at the start of the 19th century. And already 3,000 years before this, a great deal of time and extensive care was devoted to external appearance. The Ancient Egyptians were famous for their highly developed beauty culture; serving as a reference and the epitome …

The Showcase of Packaging Innovations at PACK EXPO to Feature Award-Winning Packaging Designs

Reston, Va.; July 14, 2016 — The Showcase of Packaging Innovations, sponsored by The Dow Chemical Company (NYSE: DOW), will return to PACK EXPO International (Nov. 6–9, 2016; McCormick Place, Chicago), according to PACK EXPO producer, PMMI, The Association for Packaging and Processing Technologies. The showcase will display the latest innovations and award-winning designs in packaging.

Packages for industrial goods: high tech under difficult conditions

Electricity and resources are becoming more expensive, and the shortage of freight capacity is pushing up the cost of transport. So how can high-grade packages be marketed under these difficult conditions without appreciable price rises? The manufacturers of industrial packages are showing that this is possible – by using low-cost recycled materials, participating in the …

SHAPING THE FUTURE OF PACKAGING DESIGN

Could this be Europe’s most exciting competition in packaging design? Packaging Impact Design Award (PIDA) is arranged annually by BillerudKorsnäs in cooperation with leading universities in France, Germany, Spain and Sweden. Up to 200 future packaging designers participate in PIDA every year.